METHOD FOR MANUFACTURING HEAT SINK OF SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a heat sink of a semiconductor device is provided to improve heat release efficiency of the heat sink and heat release capacity thereof by directly placing a metal layer on a bottom surface of a semiconductor device. An adhesive tape(102) having a first surface and a second surface opposite to the first surface is prepared. The first surface of the adhesive tape is attached to a surface of a temporary substrate(100). A semiconductor device(108a) having a first side and a second side opposite to the first side is prepared. The first side of the semiconductor device is pressed and set onto a partial section of the second surface of the adhesive tape to open the second side of the semiconductor device. A thin metal layer(114) is formed on the second side of the semiconductor device and an exposed section of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. The adhesive tape and the temporary substrate are removed.