REWORKABLE PASSIVE ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME AND SEMICONDUCTOR MODULE WITH THE SAME

摘要

A reworkable printed circuit board having passive elements, a method for manufacturing the same, and a semiconductor module with the same are provided to prevent electric short by connecting electrodes of passive elements and wire patterns using solder materials. A reworkable printed circuit board having passive elements includes a substrate(115), first and second filling materials(141,145), and a first passive element(160). The substrate includes first and second through holes(121,125). The first and the second filling material, which are implanted into the first and the second through hole, are made of conduction materials to be reflowed. The first passive element includes first and second electrodes(161,162). A first insertion groove(150) is formed between the first and the second through hole, and the first and the second filling material. The first passive element is positioned in the first insertion groove. The first and the second electrode are contacted with the first and the second filling materials, thereby exposing upper surfaces of the first and second electrodes, respectively.