| 摘要 |
In a thin film circuit provided with a transparent electrode layer and an Al alloy electrode layer, the transparent electrode layer and the Al alloy electrode layer are directly bonded in a bonding structure without providing a cap layer. The liquid crystal display element bonding structure is provided with the transparent electrode layer and the Al alloy electrode layer which is directly bonded to the transparent electrode layer. In the Al alloy electrode layer, a deposit having an oxidation-reduction potential within a range of -1.2V to -0.6V is dispersed. |
