SEMICONDUCTOR PACKAGE HAVING BINARY UNDERFILL AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package having underfill regions and a method for manufacturing the same are provided to prevent cracks between a semiconductor chip and a solder by concentrating a stress on the center of the solders. A semiconductor package includes a substrate(120), a semiconductor chip(110), and an underfill region(140). The substrate includes external connection terminals(125). The semiconductor chip is mounted on the substrate through solders(130) corresponding to the external connection terminals. The underfill region, which includes a first underfill region(142) adjacent to the semiconductor chip and a second underfill region(146) adjacent to the substrate, is formed in a space between the substrate and semiconductor chip. Glass transition temperature of a first material of the first underfill region is greater than that of a second of the second underfill region.