| 摘要 |
A carrier for a wafer is provided to minimize a contact area between the wafer and a slot and to reduce the amount of deionized water remaining on the wafer by using support flaps having V-shaped recesses and declined surfaces. Support flaps(170,180,190) are arranged on a body unit(140). Each of the support flaps has a V-shaped recess for receiving and supporting a circumference of a wafer(2) and a surface being declined from upper to lower. A connection unit connects the plurality of body units. The V-shaped recess formed on the support flap has a formation angle of 30 to 60 degrees. The declined surface is formed on the V-shaped recess. The support flaps support discontinuously more than a half of the circumference of the wafer.
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