| 摘要 |
An over-voltage chip protector with high surge capability and fast response time is provided to minimize a capacitance by arranging discharge induction electrodes to cross each other. An over-voltage chip protector with high surge capability and fast response time includes a substrate(0), a discharge electrode(1), an external electrode, and discharge induction electrodes(11). The discharge electrode is separated into both sides by a discharge gap(12) on the substrate. The external electrode is connected to the discharge electrode on the substrate. The discharge induction electrodes are formed on the discharge gap between the separated discharge electrodes. The discharge induction electrodes are protrusively formed on the substrate at regular intervals by a deposition process using one of Cu, Ag, Ni, Ti, TiN, Ta, TaN, SiC, Au, and Pt, a lithography process, and an etching process.
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