| 摘要 |
<p>A method for exposing a semiconductor device is provided to maximize productivity by performing TIS(Tool Induced Shift) correction in an exposure process. A wafer is loaded in a wafer stage(100). Whether TIS correction is executed is determined(110). When the TIS correction is executed, the wafer is rotated as much as a predetermined angle(120). A first alignment is then executed(130-150). The wafer is recovered from the rotated angle(160). A second alignment is then executed(170-190) and an alignment correction is executed(200). An exposure process is then executed(210). The first and second alignments sequentially execute pre-alignment, search alignment, and fine alignment.</p> |
