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发明名称
化学机械研磨系统及及研磨液
摘要
本发明提供一种采用表面化学剪裁机制研磨其上沉积有聚合物膜表面的半导体基底,再对该化学剪裁表面进行化学机械抛光的系统和方法。
申请公布号
TW200744127
申请公布日期
2007.12.01
申请号
TW095118821
申请日期
2006.05.26
申请人
安集微电子有限公司
发明人
杨春晓;俞昌
分类号
H01L21/304(2006.01)
主分类号
H01L21/304(2006.01)
代理机构
代理人
陶霖
主权项
地址
开曼群岛
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