POLISHING FLUID COMPOSITION AND POLISHING METHOD

摘要

THE PRESENT INVENTION PROVIDES A POLISHING FLUID COMPOSITION WHICH CAN EFFECTIVELY POLISH A SURFACE OF A SEMICONDUCTOR SILICON WAFER OR A SURFACE OF A FILM COMPRISING SILICON TO BE FORMED ON SILICON WAFERS WITH A MARKEDLY REDUCED AMOUNT OF COLLOIDAL SILICA TO BE USED AS ABRASIVES, OR A POLISHING FLUID COMPOSITION WHICH IS PARTICULARLY USEFUL FOR A POLISHING STEP AFTER REMOVAL OF AN OXIDE LAYER IN A TWO-STEP POLISHING METHOD. THE FORMER POLISHING FLUID COMPOSITION COMPRISES AN ALKALINE SUSPENSION WHICH CONTAINS A WATER-SOLUBLE SILICIC ACID COMPONENT, COLLOIDAL SILICA AND AN ALKALINE COMPONENT,AND WHICH HAS A PH VALUE OF 8.5 TO 13. MEANWHILE, THE LATTER POLISHING FLUID COMPOSITION COMPRISES AN ALKALINE SOLUTION WHICH CONTAINS A WATER-SOLUBLE SILICIC ACID COMPONENT AND AN ALKALINE COMPONENT, AND WHICH HAS A PH VALUE OF 8.5 TO 13; AND IS SUBSTANTIALLY FREE OF ABRASIVE PARTICLES.