| 摘要 |
<p>A semiconductor device which can surely prevent a wire bonded to an island from breaking due to, for instance, thermal shock and temperature cycle upon mounting. The semiconductor device is characterized in that the device is provided with a semiconductor chip; an island whereupon the semiconductor chip is bonded on the surface; and the wire for electrically connecting the electrode formed on the surface of the semiconductor chip with the island. The semiconductor device is further characterized in that the island is provided with a die bonding region whereupon the semiconductor chip is bonded, a wire bonding region whereupon the wire is bonded, and continuous grooves reaching a circumference of the island are formed between the die bonding region and the wire bonding region on the island.</p> |
