LEAD FRAME FOR LED AND LED PACKAGE

摘要

A lead frame for a light emitting device and a light emitting device package are provided to easily form a space unit for preventing short by coupling first and second frames. A first frame(100) includes a heat sink(110). A second frame(200) includes a mounting unit(210) and at least one pair of leads(220). The second frame is coupled to an upper side of the first frame. A hole is formed on the center of the mounting unit. At least section of the pair of leads are overlapped with the heat sink and face to each other. A space unit is formed between the heat sink and the lead. The space unit is a first groove that is formed at the overlapped section of the heat sink and the lead. The space unit is a second groove(221) that is formed on the lower side of the lead overlapped with the heat sink. A molding unit couples circumferences of the first and second frames.