| 摘要 |
<p>PURPOSE: A ball grid array(BGA) package using tab bonding is provided to remarkably reduce the whole volume of the package and a lead defect by laminating a copper thin film on a substrate so that the tab tape of conventional tab bonding is replaced. CONSTITUTION: The copper thin film(42) is formed on a cavity substrate(40) having at least one via hole(44) wherein a part of the substrate is an inner lead and a pattern is formed in the rest of the substrate. A chip(30) is electrically connected to the inner lead in the cavity of the substrate by using a bump(45) as a medium. A solder ball(50) is attached to the lower portion of the via hole under the substrate to be electrically connected to the copper thin film on the substrate. A filling material(60) is filled in a part of the substrate and the inner lead and on the chip.</p> |
