摘要 |
PROBLEM TO BE SOLVED: To suppress coating defect resulting from particles generated on the secondary of a final filter or at the tip of a nozzle. SOLUTION: The substrate processing equipment comprises a sample stand 11 for mounting a substrate 10 to be processed, a first line for supplying chemical to the substrate 10, a second line for supplying cleaning liquid of the chemical, a three-way valve 26 connected with the first and second lines and leading any one selectively to the substrate side, a filter 24 provided on the upstream side of the three-way valve 26 in the first line in order to remove contaminants in the chemical, and a nozzle 28 provided on the downstream side of the three-way valve 26 in order to deliver the chemical or cleaning liquid selected by the three-way valve 26. The first line is selected by the three-way valve 26 when the chemical is applied onto the substrate 10, otherwise the second line is selected by the three-way valve 26. COPYRIGHT: (C)2008,JPO&INPIT
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