发明名称 SUBSTRATE PROCESSING EQUIPMENT AND METHOD
摘要 PROBLEM TO BE SOLVED: To suppress coating defect resulting from particles generated on the secondary of a final filter or at the tip of a nozzle. SOLUTION: The substrate processing equipment comprises a sample stand 11 for mounting a substrate 10 to be processed, a first line for supplying chemical to the substrate 10, a second line for supplying cleaning liquid of the chemical, a three-way valve 26 connected with the first and second lines and leading any one selectively to the substrate side, a filter 24 provided on the upstream side of the three-way valve 26 in the first line in order to remove contaminants in the chemical, and a nozzle 28 provided on the downstream side of the three-way valve 26 in order to deliver the chemical or cleaning liquid selected by the three-way valve 26. The first line is selected by the three-way valve 26 when the chemical is applied onto the substrate 10, otherwise the second line is selected by the three-way valve 26. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007311408(A) 申请公布日期 2007.11.29
申请号 JP20060136613 申请日期 2006.05.16
申请人 TOSHIBA CORP 发明人 SHIOBARA HIDESHI;KATO HIROKAZU;ITO SHINICHI;MITSUYOSHI YASURO
分类号 H01L21/027 主分类号 H01L21/027
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