| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus which can obtain a good image. <P>SOLUTION: The solid state imaging apparatus 1 comprises a wiring board 10, a solid imaging chip 20, and underfill resin 30. The solid state imaging chip 20 is flip-chip mounted on the wiring board 10. The solid state imaging chip 20 images an imaged body by performing photoelectric conversion of incident light to the backside S1. The gap between the wiring board 10 and the solid state imaging chip 20 is filled with the underfill resin 30. The underfill resin 30 shades the light used for imaging by the solid state imaging chip 20. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
