| 摘要 |
PROBLEM TO BE SOLVED: To efficiently cut out a wafer high in thickness precision under a workpiece cutting method using a wire saw to cut a workpiece, etc. by cutting and feeding the workpiece such as a semiconductor ingot, etc. to a wire group constituted of a wire for cutting. SOLUTION: The method to cut the work 28 uses the wire saw on which the wire W delivered from a wire delivery/winding device 10A on one side is wound around guide rollers 24A, 24B, etc. and wound up on the wire delivery/winding device 10A on the other side. The method also has a process for linking cancellation which is a process to be practiced in the middle of a main process and to temporarily change a driving state of the wire W to give vibration to promote elimination of a linking phenomenon to bond the wires to each other, to the wire W over to a state different from the one direction driving state, in addition to the main process to proceed cutting of the work 28 in this one direction driving state by delivering the wire W from the wire delivery/winding device 10A on the one side and by driving the wire W in one direction at constant speed by winding up the wire W by the wire delivery/winding device 10B on the other side. COPYRIGHT: (C)2008,JPO&INPIT |
