| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a terminal group capable of making a solder precoat layer formed on each surface of narrow-pitch terminals of the terminal group uniform in thickness and also setting the terminals uniform in area, so that solder applied on each of the terminals as a solder precoat layer can be kept constat in amount, in a method in which the solder precoat layer is formed on the surface of the terminal group composed of two or more part-mounting terminals provided to a circuit board. SOLUTION: An interconnecting part 11 is previously formed of the same material with terminals 2a and 2b located on a circuit board 1 confronting each other and connects the terminals 2a and 2b together, an opening 3a is provided near the terminals 2a and 2b, a cover ray 3 with a positioning target 12 is laminated on the surface of the circuit board 1, a solder layer 5 is provided on the surfaces of the terminal group 2a and 2b containing the interconnecting parts 11, the solder precoat layer 6 is formed by fusing the solder layer 5 by heat, and thereafter, a disused part between the terminals 2a and 2b is cut and removed by a cutting means with an aligning mechanism based on the positioning target 12. COPYRIGHT: (C)2008,JPO&INPIT |
