SURFACE TREATMENT AGENT FOR METAL AND ITS USE

摘要

PROBLEM TO BE SOLVED: To provide a surface treatment agent for a metal by which wettability of a solder against the surface of a metal conductive part is improved when an electronic device is soldered on the surface of the metal conductive part composing a circuit of a printed circuit board, and to provide a method for manufacturing the printed circuit board in which soldering is performed using a lead-free solder after a chemical film is formed on the surface of the metal conductive part by bringing the surface treatment agent into contact with the metal conductive part. SOLUTION: The metal finishing agent includes an imidazole compound and a gluconic acid compound as active elements. COPYRIGHT: (C)2008,JPO&INPIT