| 摘要 |
A method for manufacturing a circuit board is described. A core layer of substrate comprising an insulating layer, at least one through hole and a first copper layer including a face copper and a hole copper is provided. A first photo-resist layer is formed on the face copper and defines a circuit region on the hole copper and the face copper. A second copper layer is plated on the circuit region. A second photo-resist layer is formed on the second copper and the first photo-resist layer, and defines first electrically connecting regions on the second copper layer. A metal layer is plated on the first electrically connecting regions. The first and second photo-resist layers are removed. The face copper and the second copper layer are etched to a predetermined depth to form a circuit, wherein the predetermined depth is not less than a predetermined thickness of the face copper.
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