发明名称 System and method to analyze and determine ampacity risks on PCB interconnections
摘要 Determining ampacity risks in a circuit comprises receiving geometry data of the circuit, initializing boundary conditions, initializing circuit geometry assumptions, modeling the circuit geometry data as a three-dimensional solid, computing non-Fourier heat conduction through the three-dimensional solid model using conjugate gradient numerical analysis with an incomplete Cholesky preconditioner, and generating an output indicative of a location in the three-dimensional solid model where potential thermal damage may occur in response to a predetermined excitation.
申请公布号 US2007276641(A1) 申请公布日期 2007.11.29
申请号 US20060440536 申请日期 2006.05.25
申请人 DELL PRODUCTS L.P. 发明人 MURUGAN RAJEN J.;KIRSHNAN SARAT
分类号 G06F17/50 主分类号 G06F17/50
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