SEMICONDUCTOR DEVICE ASSEMBLY WITH GAP UNDERFILL

摘要

In a method and system for underfilling a gap (140) disposed between a substrate (120) and a die (110), a selective surface (152) of the substrate is treated by a plasma source. A matching surface (154) of the die may be treated by the plasma source. The treating results in a roughening of the selective surface and the matching surface. The roughening improves wetting of an underfill (150) on the selective surface and the matching surface compared to a non-treated surface. The underfill is dispensed to substantially fill the gap disposed between the selective surface and the matching surface of the die. The underfill is substantially contained within the gap by the wetting, which reduces the backflow and the bleed of the underfill.