Micromechanical manufacturing method for vertical porous structure in semiconductor substrate, involves structuring two recesses from surface of semiconductor substrate, with structure which vertically separates recesses

摘要

The method involves structuring two recesses, from the surface (10) of the semiconductor substrate (100), with a structure, which vertically separates the recesses. The vertical structure is porously corroded by an electro-chemical etching technique. The pores of the vertical structure have a lateral opening. An independent claim is also included for a micromechanical semiconductor element, which has a semiconductor substrate.