发明名称 THERMOPLASTIC RESIN COMPOSITION AND COMPOSITE MOLDINGS
摘要 <p>A thermoplastic resin composition capable of providing composite moldings which are excellent in chemical resistance and surface appearance, in the close adhesion of surface layers made of the composition to substrate resins such as PS resin or waste thereof, and in fabricability (such as chipping resistance) and endurance (such as heat cycle resistance); and composite moldings with surface layers made of the composition. A thermoplastic resin composition comprising 100 parts by mass of the first vinyl (co)polymer (I) which is obtained by (co)polymerizing one or more monomers selected from the group consisting of aromatic vinyl compounds, vinyl cyanide and other vinyl monomers copolymerizable therewith and 1 to 100 parts by mass of a vinyl copolymer (II) which is obtained by copolymerizing vinyl cyanide with other vinyl monomer copolymerizable with vinyl cyanide and in which the vinyl cyanide content of the acetone solubles is 0.1 to 15% by mass.</p>
申请公布号 WO2007135852(A1) 申请公布日期 2007.11.29
申请号 WO2007JP59484 申请日期 2007.05.08
申请人 UMG ABS, LTD.;NISHIMOTO, KAZUO;FURUSHIGE, KATSUYA;HIRATA, KOJI;NAGAO, YOSHITO 发明人 NISHIMOTO, KAZUO;FURUSHIGE, KATSUYA;HIRATA, KOJI;NAGAO, YOSHITO
分类号 C08L25/02;C08L33/18;C08L51/00 主分类号 C08L25/02
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