| 摘要 |
A support section is provided on one side of a stem, which is secured such that at least two leads are projected from both sides. A heat sink section is formed on the upper portion of the support section in a wide width extending to the side of the projecting two leads. A laser chip is mounted on the heat sink section. As a consequence, in the event of a laser chip having a large chip size and a large calorific value, the heat sink section is large-sized to improve heat dissipation characteristics, thereby obtaining a semiconductor laser having a small outside diameter and a thin type optical pickup. |
