发明名称 PCB AND METHOD OF MANUFACTURING THEREOF
摘要 A printed circuit board and a manufacturing method thereof are provided to improve the flexural rigidity of the printed circuit board by using a reinforcing material in a core layer of the printed circuit board. A manufacturing method of a printed circuit board includes the steps of: forming a through hole by perforating a reinforcing substrate(S11) with a mechanical method; filling the through hole with an insulating material by laminating the insulating material on both sides of the reinforcing substrate(S12); perforating a via hole which penetrates the insulating material and the through hole in correspondence to the corresponding location to the through hole(S13); and plating the inner peripheral surface of the via hole, and forming a circuit pattern on the surface of the insulating material(S14).
申请公布号 KR20070113404(A) 申请公布日期 2007.11.29
申请号 KR20060046208 申请日期 2006.05.23
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JONG GUK;LIM, KYOUNG HWAN;KIM, BYOUNG HAG;KIM, KWANG YUNE;KIM, KEUN HO;JEON, IL KYOON
分类号 H05K3/00;H05K3/40;H05K3/42 主分类号 H05K3/00
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