A printed circuit board and a manufacturing method thereof are provided to improve the flexural rigidity of the printed circuit board by using a reinforcing material in a core layer of the printed circuit board. A manufacturing method of a printed circuit board includes the steps of: forming a through hole by perforating a reinforcing substrate(S11) with a mechanical method; filling the through hole with an insulating material by laminating the insulating material on both sides of the reinforcing substrate(S12); perforating a via hole which penetrates the insulating material and the through hole in correspondence to the corresponding location to the through hole(S13); and plating the inner peripheral surface of the via hole, and forming a circuit pattern on the surface of the insulating material(S14).
申请公布号
KR20070113404(A)
申请公布日期
2007.11.29
申请号
KR20060046208
申请日期
2006.05.23
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, JONG GUK;LIM, KYOUNG HWAN;KIM, BYOUNG HAG;KIM, KWANG YUNE;KIM, KEUN HO;JEON, IL KYOON