MEMS MODULE PACKAGE HAVING HEAT SPREADING FUNCTION

摘要

A MEMS module package having a heat radiation function is provided to simplify a fabricating process by using a thermal conductive material of a liquid type. A MEMS device is mounted on a lower substrate(510). A driver IC(550(1),550(2)) drives the MEMS device, mounted on the lower substrate near the MEMS device. A sealing cap(530) is coupled to the lower substrate, having a groove for receiving the MEMS device and the driver IC. The lower substrate is coupled to an outer optical module package by a thermal conductive material(505(1),505(2)) wherein the optical module package processes reflection light after predetermined light is irradiated to the MEMS device. The thermal conductive material can be thermal paste or a thermal pad.