| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact and low-cost surface acoustic wave device. <P>SOLUTION: In the surface acoustic wave device, a surface acoustic wave element 4 and a semiconductor component 10 are arranged overlapping vertically, thus reducing an occupancy area to an insulating board 1 for miniaturization, enabling a covering member 9 to seal the surface acoustic wave element 4 and to radiate the heat of a semiconductor component 10, and hence reducing the number of components, improving productivity, and obtaining a low-cost surface acoustic wave device. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
