| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip along with a method for forming a lead wiring thereof, equipped with a lead wiring formed of a plating coat, with no use of a seed film which is required for removing by etching later. SOLUTION: In the semiconductor chip, a lead wiring connected to an external connection terminal used for connecting to the outside is formed on a semiconductor substrate where a specified circuit is formed. In the method of forming the lead wiring, a metal film is vapor-deposited on the resist mask of specified pattern formed on the semiconductor substrate. Then, the resist mask is removed to allow the metal film to be the shape of lead wire. A plating film is formed on the metal film by a plating process, to form the lead wiring. COPYRIGHT: (C)2008,JPO&INPIT
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