Leiterrahmenband und Verfahren zum Herstellen einer Mehrzahl von Leiterrahmen-basierten Leuchtdiodenbauelementen

摘要

The lead frame band (9) includes several component lead frames (1) held in a support and guiding area (6). Each of the component lead frames has at least two electrical connection strips (2). The lead frames are held by connection links (3) between the connection strips and the support and guiding area. The connection links are springy, so that the lead frame can be moved in all directions with respect to the support and guiding area. An INDEPENENT CLAIM is also provided for a method for manufacturing several lead frame based light emitting diode components.