发明名称 APPARATUS AND METHOD FOR PEELING PROTECTIVE FILM STUCK ON SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To accurately form starts of peeling of a protective film stuck on a substrate surface so that peeling errors are eliminated, to reduce the time required for peeling, to minimize the amount of a peeling tape used, and to facilitate regeneration of the protective film after peeling. <P>SOLUTION: In an apparatus for peeling a protective film, each of peeling units 4 set on adjacent two corners of a liquid crystal panel A comprises: a sticking roller which moves while pressing a peeling tape 30 supplied toward a diagonal direction of the substrate against the protective film; a mechanism for raising the protective film from the corner of the substrate by peeling the peeling tape 30 stuck on the protective film from the substrate; a film chuck mechanism for clipping the protective film raised from the corner of the substrate; and a cutting mechanism for cutting the protective film at the outside of a portion clipped by the film chuck mechanism. The two peeling units 4 move toward the respective opposite corners in directions along a side of the liquid crystal panel A in a state where the film chuck mechanisms clip the protective film, whereby the protective film is peeled from the surface of the liquid crystal panel A. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007310035(A) 申请公布日期 2007.11.29
申请号 JP20060137095 申请日期 2006.05.16
申请人 TAKATORI CORP 发明人 IKEDA SHUICHI
分类号 G02B5/30;G02F1/1335 主分类号 G02B5/30
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