| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can function to receive a signal and information externally, and to transmit a signal and information externally while achieving miniaturization and thinning, and to provide its manufacturing process. SOLUTION: The semiconductor device 1 comprises a plurality of constitutive layers 2 each formed of any one of a substrate 3 or a semiconductor element 4, a resin layer 5 interposed between adjoining constitutive layers 2, and a functional element 8 mounted on at least any one constitutive layer 2 and functioning to perform at least any one of reception of a signal or information externally and transmission of a signal or information externally. COPYRIGHT: (C)2008,JPO&INPIT
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