APPARATUS AND METHOD FOR ELECTROPLATING

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a plated layer on a disk by electroplating by which in-plane uniformity of the plated film thickness on the disk is realized by use of a simple device and both sides of disks totaling at eight surfaces can be plated at once. SOLUTION: A feeding jig is used as a cathodic electrode 1, to which electric current is fed via a feeding ring from the outer circumference of the disk. Anode electrodes 3 are disposed oppositing the cathodic electrode 1 on its both sides. Electric shield plates 2 having circle apertures are disposed horizontally to both of the cathodic electrode 1 and the anode electrodes 3. Electroplating is performed while plating liquid is flown onto the feeding jig at a uniform flow rate by an agitating nozzle 4. A part of the feeding ring is released to secure a secondary cathodic function. COPYRIGHT: (C)2008,JPO&INPIT