| 摘要 |
This invention relates to a process for manufacturing interconnection structures, including: a) the formation on a substrate of a first layer comprising one or several conducting zones ( 24 ) and one or several insulating zones made of an organic material ( 26 ), b) coverage of this first layer by a porous layer ( 28 ), c) consumption and elimination of at least part of the organic material through the porous layer, using enzymes and/or proteins.
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