Stressed organic semiconductor devices

摘要

An organic semiconductor device including: a substrate having a first thermal expansion coefficient; and an organic semiconductor material coupled to the substrate at an interface therebetween. The organic semiconductor material includes a polymer organic semiconductor material and/or an oligomer organic semiconductor material. The organic semiconductor material also has a second thermal expansion coefficient that is different from the first thermal expansion coefficient, such that a mechanical stress is transferred from the substrate to the organic semiconductor material through the interface. This mechanical stress is related to the difference between the first and second thermal expansion coefficients and the change in temperature of the organic semiconductor device.