| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer module with a case which is simple in structure, hardly causes a scale enlargement of a product, is equipped with the case which has high adhesion to a multilayer substrate, and is very reliable. <P>SOLUTION: Two or more side electrodes 4 extending in the direction in which ceramic layers are laminated are provided to, at least, one of the side faces 3 of a multilayer module main body 1, at least, one of inner conductor layers 5 is exposed to a region which is located on the side face where the side electrodes are arranged and sandwiched between a pair of the side electrodes 4 adjacent to each other, the pawl 22 of a metal case 21 is soldered to the side electrodes and the inner conductor layer 5. The inner conductor layers 5 exposed to the region, which is located on the side face of the multilayer module main body 1 and sandwiched between the side electrodes 4, are exposed to the side face, at least, overlapping partially with each other when the inner conductor layers are observed from a viewpoint as to the lamination direction of the ceramic layers. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
