| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain an electronic apparatus which cools a plurality of heat generating components and mount them in a high level. <P>SOLUTION: An electronic apparatus 1 includes: an enclosure 6; a circuit board 11 having a first face 11a and a second face 11b; a first heat generating component 21 mounted on the first face 11a; a second heat generating component 22 mounted on the second face 11b; a cooling fan 12; a first heat dissipating member 15 facing the cooling fan 12; a second heat dissipating member 16 disposed side by side with the first heat dissipating member 15; a first heat transfer member 13 which is extended along the first face 11a and is provided between the first heat generating component 21 and the first heat dissipating member 15; and a second heat transfer member 14 which is extended along the second face 11b and is provided between the second heat generating component 22 and the second heat dissipating member 16. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
