发明名称 |
BODY FORMED WITH THROUGH-HOLE AND LASER BEAM MACHINING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser beam machining method having simple constitution by which a tapered shape can be suppressed, and neither burrs nor adhesion of scattering occurs, and to provide a body formed with a through-hole. <P>SOLUTION: The laser beam machining method is provided for machining the through-hole on a workpiece 1 by using a pulse laser beam and the method is provided with: a step where an attachable and detachable sacrificial layer 1a is provided on the workpiece 1; a step where the through-hole is machined on the workpiece by the laser beam in such a state that the sacrificial layer 1a is provided; and a step where the sacrificial layer is removed from the workpiece after the through-hole machining step. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007307599(A) |
申请公布日期 |
2007.11.29 |
申请号 |
JP20060140967 |
申请日期 |
2006.05.20 |
申请人 |
SUMITOMO ELECTRIC IND LTD;KYOTO UNIV |
发明人 |
MISHIMA HIDEHIKO;OKUDA YASUHIRO;SAKABE SHUJI;HASHIDA MASAKI;SHIMIZU SEIJI |
分类号 |
B23K26/38;B23K26/18;B23K101/42;H05K3/00 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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