发明名称 SUBSTRATE ASSEMBLING DEVICE AND SUBSTRATE ASSEMBLING METHOD USING THE DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laminating device in which substrates are surely held even in a vacuum and no distortion occurs on the substrate in peeling off an adhesive member from a substrate surface. <P>SOLUTION: A substrate assembling device is constructed in such a way that an elastic plate equipped with an elastic body, a vacuum suction mechanism, and a purge gas blowing mechanism on a substrate retaining surface is arranged on an upper table mounted inside a chamber, and a plurality of adhesive pins are provided on an adhesive pin plate capable of up-and-down movements independent of the upper table, through holes through which the adhesive pins are movable are arranged on the upper table and the elastic plate, and an adhesive mechanism is provided on the tips of the adhesive pins. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007310041(A) 申请公布日期 2007.11.29
申请号 JP20060137211 申请日期 2006.05.17
申请人 HITACHI PLANT TECHNOLOGIES LTD 发明人 KAIZU TAKUYA;IMAI HIROAKI;SAITO MASAYUKI
分类号 G02F1/13 主分类号 G02F1/13
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