摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing methods for cleaning sheet and transfer member with cleaning function which are superior in foreign matter removing performance and transfer performance, and can suppress contamination caused by a silicon compound in a cleaning layer, and to provide a cleaning method for substrate processing device using such a cleaning sheet and a transfer member with cleaning function as above. SOLUTION: In the cleaning layer, relative strengths (a positive ion is a C<SB>2</SB>H<SB>3</SB><SP>+</SP>ratio, and a negative ion is an O<SP>-</SP>ratio) of a specified fragment ion of the cleaning layer are 0.1 or less respectively in a time-of-flight type secondary ion mass spectrometry. In the manufacturing method for cleaning sheet, plasma treatment is performed for the cleaning layer wherein the relative strength (the positive ion is the C<SB>2</SB>H<SB>3</SB><SP>+</SP>ratio, and the negative ion is the O<SP>-</SP>ratio) of at least one fragment ion of the specified fragment ions is 0.1 or less in the time-of-flight type secondary ion mass spectrometry. COPYRIGHT: (C)2008,JPO&INPIT
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