| 摘要 |
PROBLEM TO BE SOLVED: To form a plating film having a good adhesion by an electroless plating method in a simple process without conducting a rough surface treatment on a surface to be treated of a liquid crystal polymer carrier, and to form a circuit electrode with a fine pitch wiring pattern by using the plating film. SOLUTION: In the method, ultraviolet light is irradiated on a liquid crystal polymer carrier including no filler in an ultraviolet treatment step, and thereafter the liquid crystal polymer carrier is brought into contact with sulfuric acid/hydrogen peroxide mixture in a liquid solution treatment step. Then alkali treatment is performed on the liquid crystal polymer carrier in an alkali treatment step, and a catalyst is imparted on the liquid crystal polymer carrier in a catalytic treatment step. After the liquid crystal polymer carrier is brought into contact with plating liquid in a plating step, the liquid crystal polymer carrier is heated under pressure in a heat treatment step. COPYRIGHT: (C)2008,JPO&INPIT
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