| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition of which cured material has a high heat resistance, and flexibility and stickiness at a high temperature, having a long time pot life of the composition before the curing of the same. SOLUTION: This thermosetting polyimide resin composition is obtained by heat-treating a tetracarboxylic acid component consisting of≥1 compound selected from a tetra carboxylic acid dianhydride, tetracarboxylic acid or a derivative of the tetracarboxylic acid with an aliphatic amine in an excess of the tetracarboxylic acid component to form (A) a polyimide and blending (B) a polyimide obtained by heat-reacting an aromatic diamine with the (A) polyimide, with a bismaleimide compound, and the cured material of the same is also provided. COPYRIGHT: (C)2008,JPO&INPIT
|
