发明名称 OBJECT HAVING THROUGH-HOLE FORMED THEREIN AND LASER PROCESSING METHOD
摘要 A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on the workpiece, and a step of removing the sacrificial layer (5) from the workpiece after the through-hole forming step.
申请公布号 WO2007135955(A1) 申请公布日期 2007.11.29
申请号 WO2007JP60148 申请日期 2007.05.17
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;KYOTO UNIVERSITY;MISHIMA, HIDEHIKO;OKUDA, YASUHIRO;SAKABE, SHUJI;HASHIDA, MASAKI;SHIMIZU, SEIJI 发明人 MISHIMA, HIDEHIKO;OKUDA, YASUHIRO;SAKABE, SHUJI;HASHIDA, MASAKI;SHIMIZU, SEIJI
分类号 B23K26/38;B23K26/18;B23K101/42;H05K3/00 主分类号 B23K26/38
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