OBJECT HAVING THROUGH-HOLE FORMED THEREIN AND LASER PROCESSING METHOD
摘要
A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on the workpiece, and a step of removing the sacrificial layer (5) from the workpiece after the through-hole forming step.
申请公布号
WO2007135955(A1)
申请公布日期
2007.11.29
申请号
WO2007JP60148
申请日期
2007.05.17
申请人
SUMITOMO ELECTRIC INDUSTRIES, LTD.;KYOTO UNIVERSITY;MISHIMA, HIDEHIKO;OKUDA, YASUHIRO;SAKABE, SHUJI;HASHIDA, MASAKI;SHIMIZU, SEIJI