| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus for heat-treating a substrate capable of obtaining a uniform temperature in the surface of the substrate during the heat treatment, and capable of obtaining a uniform pattern line width, a heat treatment method, a heat treatment program, and a recording medium having that program recorded therein. SOLUTION: This heat treatment apparatus comprises a substrate holding means for holding the substrate W, and a heating means 25 for heating the substrate W held by the substrate holding means from above and/or from below. The substrate holding means has a mount 24 on which the substrate W is mounted, and airflow forming means 51-56 for forming an airflow between the substrate W and the mount 24. Upon the heating treatment by the heating means 25, the substrate W is supported at the whole undersurface thereof by the airflow formed by the airflow forming means 51-56 and is held in a floating state thereof. COPYRIGHT: (C)2008,JPO&INPIT
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