| 摘要 |
A piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the A piezoelectric oscillator has a resonator package (50) accommodating a piezoelectric resonating element (51) therein, and an IC chip (40) fixed onto a rear surface (58) of the resonator package and having an oscillating circuit therein. An inner lead portion (61a, 62a, 63a, 64a) of a lead frame is fixed onto the rear surface (58) of the resonator package, and the resonator package and the IC chip are resin molded except an outer lead portion of the lead frame. <IMAGE> |
