METHOD OF ELECTROLYTIC GOLD PLATING FOR PRINTED CIRCUIT BOARD

摘要

A method of electrolytic gold plating on a printed circuit board is provided to perform the electrolytic gold plating by applying a copper plating layer on the printed circuit board performing as a lead line. A method of electrolytic gold plating(15) on a printed circuit board includes the steps of: etching a copper layer from an epoxy resin substrate(10); applying an electroless copper plating(13) on an etched epoxy resin layer; forming a first mask layer for forming a circuit pattern; forming a circuit by performing electrolytic copper plating by using the first mask as a mask; forming a second mask layer defining an area to perform the electrolytic gold plating; performing the electrolytic gold plating by using the second mask as a mask; exfoliating the first and second mask layers; and removing an exposed electroless copper plating layer.