| 摘要 |
PROBLEM TO BE SOLVED: To provide a replacing device and a replacing method which effectively reduce the winding of a first support for supporting a plate member such as semiconductor wafer, etc. in an expanded state when the support is released from the expanded state for replacing the plate member to a second support, this preventing the trouble due to the winding. SOLUTION: The method comprises supporting a chip-like wafer W with a first thermally shrinkable support 1, adhering a second support 2 to the wafer W after being expanded, and heating the first support 1 by a heating means 29 to release the support 1 from the expanded state while the support 1 shrinks by the heat. COPYRIGHT: (C)2008,JPO&INPIT |
