| 摘要 |
PROBLEM TO BE SOLVED: To achieve heat dissipation on a circuit board mounted with a coil and a plurality of electric elements through which supply current and emission current to the coil are made to flow, without enlarging a mounting area as much as possible. SOLUTION: Two frame bodies 51 and 52 of a heat dissipating block, a switching regulator 33 and a Schottky barrier diode 34 in front and rear stages of a choke coil 32 are mounted on a mounting surface 31a of a circuit board 31 of a circuit unit 3, and are decentrally housed and fixed, respectively. The frame bodies 51, 52 are connected with a heat dissipating fin 53 which dissipates the heat transferred from the switching regulator 33 and the Schottky barrier diode 34 via each frame bodies 51 and 52, respectively, to the peripheral atmosphere. The choke coil 32 on the mounting surface 31a is arranged in a recessed part 54 defined by these two frame bodies 51 and 52 and the heat dissipating fin part 53. COPYRIGHT: (C)2008,JPO&INPIT
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