发明名称 STICKING METHOD AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a sticking method and apparatus therefor in which objects to be bonded are highly accurately stuck while relaxing an impulse load and an eccentric load when sticking plate-like objects to be bonded. SOLUTION: An elastic body 7 is provided in a head 12 which is elevated and driven by a driving part, or in a stage 13 which holds one object to be bonded so as to relax the impulse load or eccentric load when two objects to be bonded are brought into contact with each other, and the two objects to be bonded are stuck together with a load required for bonding after temporary pressurization due to a load detecting means 9 and a control amplifier 10, until a load value becomes uniform. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007311683(A) 申请公布日期 2007.11.29
申请号 JP20060141241 申请日期 2006.05.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIWAKI KENTARO;MAEKAWA YUKIHIRO
分类号 H01L21/60 主分类号 H01L21/60
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