发明名称 MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping device in which a clearance distance between an electromagnet and a suction plate is adjusted easily and accurately. SOLUTION: A magnetic field is formed in the clearance between a rear platen 13A which functions as the electromagnet and the suction plate 22A, and mold clamping force is generated by suction force acting on the suction plate 22A. The opposed surfaces of the rear platen 13A and the suction plate 22A which form the clearance are inclined by a prescribed angle from the vertical direction. The rear platen 13A or the suction plate 22A is moved in the vertical direction and fixed. A height adjustment mechanism 60 is installed in either one of the rear platen 13A and the suction plate 22A, which can be moved vertically. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007307867(A) 申请公布日期 2007.11.29
申请号 JP20060141803 申请日期 2006.05.22
申请人 SUMITOMO HEAVY IND LTD 发明人 MORIYA KOJI;MORITA HIROSHI;ANDO MANABU;YAMAMOTO TAIZO
分类号 B29C45/66;B22D17/26;B29C45/76 主分类号 B29C45/66
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