SEMICONDUCTOR DEVICE WITH A DISTRIBUTED PLATING PATTERN
摘要
A substrate, and a semiconductor die package formed therefrom, are disclosed which include a distributed plating pattern for reducing mechanical stress on the semiconductor die. The substrate according to embodiments of the invention may include traces and contact pads plated in a double image plating process. Additionally, the substrate may include dummy plating areas including plating material. The plated vias and/or traces and the plating material within the dummy plating areas provide a plating pattern which is evenly distributed across the surface of the substrate. The even distribution of the plating pattern prevents peaks and valleys in the finished substrate.
申请公布号
WO2007136651(A2)
申请公布日期
2007.11.29
申请号
WO2007US11728
申请日期
2007.05.16
申请人
SANDISK CORPORATION;LIAO, CHIH-CHIN;CHEN, HAN-SHIAO;CHIU, CHIN-TIEN;YU, CHEEMEN;TAKIAR, HEM
发明人
LIAO, CHIH-CHIN;CHEN, HAN-SHIAO;CHIU, CHIN-TIEN;YU, CHEEMEN;TAKIAR, HEM