Method for releasing substrate wafer from combination of two substrate wafers has adhesive layer placed between them, involves applying of pressure with separating device against lateral edges of one of two substrate wafers

摘要

The method involves applying of pressure with a separating device (4) against lateral edges of one of the two substrate wafers (10,12). A gap is produced between the substrate wafers. A gas is blown into the gap to release one of the substrate wafers fully from the other substrate wafer, such that the adhesive layers (11,14) remains fully at the other substrate wafer. An independent claim is also included for a device for releasing a substrate wafer from a combination of two substrate wafers.